3D microelectronics: Teaching experience and research promising field

Abir M'Zah, Omar Hammami

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

3D Design is not really a new technology; in fact the first ASIC design was designed in 1986. These last years, the interest in 3D is emerging to deal with the problem of the interconnect delay which is overcoming the gates delay in nanometer technologies. 3D ASIC design is facing industrial and academic challenges. We present in this work, the description of a 3D ASIC designs practical work teaching to students applying to the Master degree.

Original languageEnglish
Title of host publication2012 International Conference on Education and e-Learning Innovations, ICEELI 2012
DOIs
Publication statusPublished - 1 Dec 2012
Event2012 International Conference on Education and e-Learning Innovations, ICEELI 2012 - Sousse, Tunisia
Duration: 1 Jul 20123 Jul 2012

Publication series

Name2012 International Conference on Education and e-Learning Innovations, ICEELI 2012

Conference

Conference2012 International Conference on Education and e-Learning Innovations, ICEELI 2012
Country/TerritoryTunisia
CitySousse
Period1/07/123/07/12

Keywords

  • 3D Design
  • ASIC
  • challenges
  • teaching

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