Analytical methods to assess transient faults effects in logic circuits

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This work addresses transient faults in deep submicron technologies. We focus on reliability assessment approaches highlighting those based on analytical models. The paper includes a description of solutions reported in the literature and discusses their suitability from a reliability improvement perspective.

Original languageEnglish
Title of host publication2014 IEEE 57th International Midwest Symposium on Circuits and Systems, MWSCAS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages667-670
Number of pages4
ISBN (Electronic)9781479941346, 9781479941346
DOIs
Publication statusPublished - 23 Sept 2014
Event2014 IEEE 57th International Midwest Symposium on Circuits and Systems, MWSCAS 2014 - College Station, United States
Duration: 3 Aug 20146 Aug 2014

Publication series

NameMidwest Symposium on Circuits and Systems
ISSN (Print)1548-3746

Conference

Conference2014 IEEE 57th International Midwest Symposium on Circuits and Systems, MWSCAS 2014
Country/TerritoryUnited States
CityCollege Station
Period3/08/146/08/14

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