Atomic-plane-thick reconstruction across the interface during heteroepitaxial bonding of InP-clad quantum wells to Si

  • A. Talneau
  • , C. Roblin
  • , A. Itawi
  • , O. Mauguin
  • , L. Largeau
  • , G. Beaudouin
  • , I. Sagnes
  • , G. Patriarche

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Monolithic integration of InP-based materials on Si will allow lasers as well as optical amplifiers operating at 1.55μm to be efficiently included in photonic integrated circuits. We demonstrate here oxide-free heteroepitaxial bonding of InP-clad GaInAs quantum wells to Si, with an atomic-plane-thick reconstruction across the InP-Si interface. The wells photoluminescence emitted-wavelength demonstrates no shift after bonding. Several InP surface activation procedures have been investigated. This bonding approach is compatible with guiding designs including a nanostructuration, thus enabling specific designs associated to desirable optical functions.

Original languageEnglish
Title of host publication2012 International Conference on Indium Phosphide and Related Materials, IPRM 2012
Pages130-132
Number of pages3
DOIs
Publication statusPublished - 1 Dec 2012
Externally publishedYes
Event2012 International Conference on Indium Phosphide and Related Materials, IPRM 2012 - Santa Barbara, CA, United States
Duration: 27 Aug 201230 Aug 2012

Publication series

NameConference Proceedings - International Conference on Indium Phosphide and Related Materials
ISSN (Print)1092-8669

Conference

Conference2012 International Conference on Indium Phosphide and Related Materials, IPRM 2012
Country/TerritoryUnited States
CitySanta Barbara, CA
Period27/08/1230/08/12

Keywords

  • III-V integration on Si
  • heteroepitaxial bonding
  • interface TEM analysis
  • photonic integrated circuits
  • surface reconstruction

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