TY - GEN
T1 - Characterization at logical level of magnetic injection probes
AU - Trabelsi, Oualid
AU - Sauvage, Laurent
AU - Danger, Jean Luc
N1 - Publisher Copyright:
© 2019 The Institute of Electronics, Information and Communication Engineer.
PY - 2019/6/1
Y1 - 2019/6/1
N2 - Intentional electromagnetic interference is an effective mean to jeopardize the security of integrated circuits. In this paper, we propose a new approach to evaluate the efficiency of magnetic probes used to radiate a disturbance: measuring its impact within the target of the attack, more precisely on the propagation delay of a combinational path. The characterization of five probes carried out using three different integrated circuits is reported. In all cases, bespoke, handmade probes outperform commercial ones. Experimental results also show that the electromagnetic coupling between the probes and the integrated circuits is mainly due to global, bonding wires.
AB - Intentional electromagnetic interference is an effective mean to jeopardize the security of integrated circuits. In this paper, we propose a new approach to evaluate the efficiency of magnetic probes used to radiate a disturbance: measuring its impact within the target of the attack, more precisely on the propagation delay of a combinational path. The characterization of five probes carried out using three different integrated circuits is reported. In all cases, bespoke, handmade probes outperform commercial ones. Experimental results also show that the electromagnetic coupling between the probes and the integrated circuits is mainly due to global, bonding wires.
KW - Field programmable gate array
KW - Immunity testing
KW - Probes
KW - Side-channel attacks
U2 - 10.23919/EMCTokyo.2019.8893692
DO - 10.23919/EMCTokyo.2019.8893692
M3 - Conference contribution
AN - SCOPUS:85075266866
T3 - 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019
SP - 625
EP - 628
BT - 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019
Y2 - 3 June 2019 through 7 June 2019
ER -