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Compression Induced Deformation Twinning Evolution in Liquid-Like Cu2Se

  • Ben Huang
  • , Guodong Li
  • , Chenyang Xiao
  • , Bo Duan
  • , Wenjuan Li
  • , Pengcheng Zhai
  • , William A. Goddard
  • Wuhan University of Technology
  • California Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

For practical applications of copper selenide (Cu2Se) thermoelectric (TE) materials with liquid-like behavior, it is essential to determine the structure-property relations as a function of temperature. Here, we investigate β-Cu2Se structure evolution during uniaxial compression over the temperature range of 400-1000 K using molecular dynamics simulations. We find that at temperatures above 800 K, Cu2Se exhibits poor stability with breaking order that is described as a liquid-like or hybrid structure comprising a rigid Se sublattice and mobile Cu ions. A uniaxial load causes accumulated structural heterogeneity that is alleviated by diffusion-induced accommodation of local deformations. With increasing strain, the deformation mode changes into a combination of compression and shear, accompanied by restructuring in terms of twinning. Interestingly, in addition to a plastic behavior rarely found in inorganic semiconductors, we find that higher temperature promotes deformation twinning in liquid-like Cu2Se, showing the role of thermal instability, including Cu diffusion, in structural adaptation and mechanical modulation. These findings reveal the micromechanism of hybrid structural evolution as well as performance tuning through twinning, which provides a theoretical guide toward advanced Cu2Se TE materials design.

Original languageEnglish
Pages (from-to)18671-18681
Number of pages11
JournalACS Applied Materials and Interfaces
Volume14
Issue number16
DOIs
Publication statusPublished - 27 Apr 2022
Externally publishedYes

Keywords

  • deformation twinning
  • ionic diffusion
  • liquid-like thermoelectric material
  • plastic flow
  • temperature effect

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