Csp3-Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes

  • Matthew Paeth
  • , Sam B. Tyndall
  • , Liang Yu Chen
  • , Jia Cheng Hong
  • , William P. Carson
  • , Xingwu Liu
  • , Xiaodong Sun
  • , Jinjia Liu
  • , Kundi Yang
  • , Elizabeth M. Hale
  • , David L. Tierney
  • , Bin Liu
  • , Zhi Cao
  • , Mu Jeng Cheng
  • , William A. Goddard
  • , Wei Liu

Research output: Contribution to journalArticlepeer-review

Abstract

Carbon-carbon bond-forming reductive elimination from elusive organocopper(III) complexes has been considered the key step in many copper-catalyzed and organocuprate reactions. However, organocopper(III) complexes with well-defined structures that can undergo reductive elimination are extremely rare, especially for the formation of Csp3-Csp3 bonds. We report herein a general method for the synthesis of a series of [alkyl-CuIII-(CF3)3]- complexes, the structures of which have been unequivocally characterized by NMR spectroscopy, mass spectrometry, and X-ray crystal diffraction. At elevated temperature, these complexes undergo reductive elimination following first-order kinetics, forming alkyl-CF3 products with good yields (up to 91%). Both kinetic studies and DFT calculations indicate that the reductive elimination to form Csp3-CF3 bonds proceeds through a concerted transition state, with a ΔH = 20 kcal/mol barrier.

Original languageEnglish
Pages (from-to)3153-3159
Number of pages7
JournalJournal of the American Chemical Society
Volume141
Issue number7
DOIs
Publication statusPublished - 20 Feb 2019
Externally publishedYes

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