Cure behaviors and thermal stabilities of tetrafunctional epoxy resin toughened by polyamideimide

Soo Jin Park; Gun Young Heo; Fan Long Jin

doi:10.1007/s13233-015-3051-z

Cure behaviors and thermal stabilities of tetrafunctional epoxy resin toughened by polyamideimide

Soo Jin Park
, Gun Young Heo
, Fan Long Jin

Research output: Contribution to journal › Article › peer-review

Abstract

The effect of polyamideimide (PAI) content on the cure behaviors and thermal stabilities of 4,4′-tetraglycidyl diaminodiphenyl methane (TGDDM) epoxy resin/polyamideimide (PAI) blends was investigated. The experimental results revealed that the main exothermic peak and cure activation energy (E_a) of the blends decreased with increasing PAI content, presumably because the curing reaction was accelerated by the presence of secondary amine groups of the PAI backbone. The decomposition activation energy (E_d) of the blends was maximized at 5 phr PAI and decreased above this content; this was attributed to the short-chain structural network in TGDDM/PAI blends, which was derived from etherification and chain-scission reactions caused by the secondary amine of PAI.

Original language	English
Pages (from-to)	320-324
Number of pages	5
Journal	Macromolecular Research
Volume	23
Issue number	4
DOIs	https://doi.org/10.1007/s13233-015-3051-z
Publication status	Published - 1 Apr 2015
Externally published	Yes

Keywords

cure activation energy
cure behavior
epoxy resin
polyamideimide
thermal stability

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10.1007/s13233-015-3051-z

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title = "Cure behaviors and thermal stabilities of tetrafunctional epoxy resin toughened by polyamideimide",

abstract = "The effect of polyamideimide (PAI) content on the cure behaviors and thermal stabilities of 4,4′-tetraglycidyl diaminodiphenyl methane (TGDDM) epoxy resin/polyamideimide (PAI) blends was investigated. The experimental results revealed that the main exothermic peak and cure activation energy (Ea) of the blends decreased with increasing PAI content, presumably because the curing reaction was accelerated by the presence of secondary amine groups of the PAI backbone. The decomposition activation energy (Ed) of the blends was maximized at 5 phr PAI and decreased above this content; this was attributed to the short-chain structural network in TGDDM/PAI blends, which was derived from etherification and chain-scission reactions caused by the secondary amine of PAI.",

keywords = "cure activation energy, cure behavior, epoxy resin, polyamideimide, thermal stability",

author = "Park, \{Soo Jin\} and Heo, \{Gun Young\} and Jin, \{Fan Long\}",

note = "Publisher Copyright: {\textcopyright} 2015, The Polymer Society of Korea and Springer Sciene+Business Media Dordrecht.",

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doi = "10.1007/s13233-015-3051-z",

language = "English",

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journal = "Macromolecular Research",

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TY - JOUR

T1 - Cure behaviors and thermal stabilities of tetrafunctional epoxy resin toughened by polyamideimide

AU - Park, Soo Jin

AU - Heo, Gun Young

AU - Jin, Fan Long

PY - 2015/4/1

Y1 - 2015/4/1

N2 - The effect of polyamideimide (PAI) content on the cure behaviors and thermal stabilities of 4,4′-tetraglycidyl diaminodiphenyl methane (TGDDM) epoxy resin/polyamideimide (PAI) blends was investigated. The experimental results revealed that the main exothermic peak and cure activation energy (Ea) of the blends decreased with increasing PAI content, presumably because the curing reaction was accelerated by the presence of secondary amine groups of the PAI backbone. The decomposition activation energy (Ed) of the blends was maximized at 5 phr PAI and decreased above this content; this was attributed to the short-chain structural network in TGDDM/PAI blends, which was derived from etherification and chain-scission reactions caused by the secondary amine of PAI.

AB - The effect of polyamideimide (PAI) content on the cure behaviors and thermal stabilities of 4,4′-tetraglycidyl diaminodiphenyl methane (TGDDM) epoxy resin/polyamideimide (PAI) blends was investigated. The experimental results revealed that the main exothermic peak and cure activation energy (Ea) of the blends decreased with increasing PAI content, presumably because the curing reaction was accelerated by the presence of secondary amine groups of the PAI backbone. The decomposition activation energy (Ed) of the blends was maximized at 5 phr PAI and decreased above this content; this was attributed to the short-chain structural network in TGDDM/PAI blends, which was derived from etherification and chain-scission reactions caused by the secondary amine of PAI.

KW - cure activation energy

KW - cure behavior

KW - epoxy resin

KW - polyamideimide

KW - thermal stability

UR - https://www.scopus.com/pages/publications/84939933227

U2 - 10.1007/s13233-015-3051-z

DO - 10.1007/s13233-015-3051-z

M3 - Article

AN - SCOPUS:84939933227

SN - 1598-5032

VL - 23

SP - 320

EP - 324

JO - Macromolecular Research

JF - Macromolecular Research

IS - 4

ER -

Cure behaviors and thermal stabilities of tetrafunctional epoxy resin toughened by polyamideimide

Abstract

Keywords

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