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Design insights for reliable energy efficient OxRAM-based flip-flop in 28nm FD-SOI

  • Natalija Jovanovic
  • , Elisa Vianello
  • , Olivier Thomas
  • , Borivoje Nikolic
  • , Lirida Naviner
  • LETI (CEA-Technologies Avancees)
  • University of California, Berkeley

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

This paper investigates the design architecture and the optimum resistance state values for high-endurance, high-yield energy-efficient OxRAM-based non-volatile flip-flops (NVFF) for ultra-low power applications in 28nm FD-SOI. Silicon measurements demonstrate that a low programming current improves endurance, but at the expense of a reduced memory window (ROFF/RON). Statistical analyses show that the scaling limitation of the NVFF operating voltage in restore mode can be overcome with a narrow memory window by using a current-based design solution. Low variability of the FD-SOI enables to operate down-to 0.7V with more than 108 of endurance cycles.

Original languageEnglish
Title of host publication2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509002597
DOIs
Publication statusPublished - 20 Nov 2015
EventIEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2015 - Rohnert Park, United States
Duration: 5 Oct 20158 Oct 2015

Publication series

Name2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2015

Conference

ConferenceIEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2015
Country/TerritoryUnited States
CityRohnert Park
Period5/10/158/10/15

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