TY - JOUR
T1 - Dual-frequency capacitive radiofrequency discharges
T2 - Effect of low-frequency power on electron density and ion flux
AU - Booth, J. P.
AU - Curley, G.
AU - Marić, D.
AU - Chabert, P.
PY - 2010/1/1
Y1 - 2010/1/1
N2 - The dependence of electron density and ion flux on radiofrequency (RF) power has been measured in a 2 + 27 MHz dual-frequency capacitive discharge with silicon electrodes at 6.7 Pa gas pressure. In Ar/O2 mixtures the electron density and the ion flux vary in a very similar way (i.e. their ratio, υ, is constant), in good agreement with the simple electropositive transport theory. Both 27 and 2 MHz RF powers have a significant effect on the plasma density and the ion flux. The effect of the 2 MHz power is likely a combination of enhanced plasma heating by dual-frequency excitation and ionization caused by secondary electron beams, which are known to be produced efficiently at oxidized silicon surfaces. In contrast, in Ar/C4F 8/O2 mixtures such as those used for industrial dielectric etching, υ is always bigger than the theoretical electropositive value, and becomes very high when the ratio of 2 to 27 MHz power is high. Under these conditions the electron density is very small, whereas the ion flux remains considerable. We attribute the increased plasma transport to the presence of a significant density of F- negative ions, combined with increased penetration of the 2 MHz electric field into the plasma bulk at high 2/27 MHz power ratios.
AB - The dependence of electron density and ion flux on radiofrequency (RF) power has been measured in a 2 + 27 MHz dual-frequency capacitive discharge with silicon electrodes at 6.7 Pa gas pressure. In Ar/O2 mixtures the electron density and the ion flux vary in a very similar way (i.e. their ratio, υ, is constant), in good agreement with the simple electropositive transport theory. Both 27 and 2 MHz RF powers have a significant effect on the plasma density and the ion flux. The effect of the 2 MHz power is likely a combination of enhanced plasma heating by dual-frequency excitation and ionization caused by secondary electron beams, which are known to be produced efficiently at oxidized silicon surfaces. In contrast, in Ar/C4F 8/O2 mixtures such as those used for industrial dielectric etching, υ is always bigger than the theoretical electropositive value, and becomes very high when the ratio of 2 to 27 MHz power is high. Under these conditions the electron density is very small, whereas the ion flux remains considerable. We attribute the increased plasma transport to the presence of a significant density of F- negative ions, combined with increased penetration of the 2 MHz electric field into the plasma bulk at high 2/27 MHz power ratios.
U2 - 10.1088/0963-0252/19/1/015005
DO - 10.1088/0963-0252/19/1/015005
M3 - Article
AN - SCOPUS:70450208772
SN - 0963-0252
VL - 19
JO - Plasma Sources Science and Technology
JF - Plasma Sources Science and Technology
IS - 1
M1 - 015005
ER -