Abstract
The effect of an alkenyl side-chain of succinic anhydride (SA) on the thermal behavior and the coefficient of thermal expansion (CTE) of diglycidylether of bisphenol A (DGEBA) epoxy resins was studied. The number of carbons in the side-chain of SA was varied from 6 to 14 and N,N-Dimethylbenzylamine was used as an accelerator. As a result, the reactivity of SA with epoxide groups was decreased on increasing the length of the alkenyl side-chain of SA. The thermal stabilities of cured DGEBA/SA samples were approximately constant with varying alkenyl side-chain of SA. Also, the CTE of the systems was increased as the length of the alkenyl side-chain of SA increased. This could be attributed to the increased motion of the chain segments in the epoxy network structure induced by the longer alkenyl side-chain of SA. The effect of amount anhydride, thermoplastics, and fillers on the CTE of the epoxy resins was also discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 1289-1295 |
| Number of pages | 7 |
| Journal | Polymer International |
| Volume | 55 |
| Issue number | 11 |
| DOIs | |
| Publication status | Published - 1 Nov 2006 |
| Externally published | Yes |
Keywords
- Crosslinking
- Curing of polymers
- Thermal properties
- Thermosets