TY - JOUR
T1 - Gallium nitride deposition via magnetron sputtering
T2 - Linking plasma-surface interactions and thin film crystalline features
AU - Srinivasan, Lakshman
AU - Gazeli, Kristaq
AU - Prasanna, Swaminathan
AU - Invernizzi, Laurent
AU - Roca i Cabarrocas, Pere
AU - Lombardi, Guillaume
AU - Ouaras, Karim
N1 - Publisher Copyright:
© 2024 Elsevier Ltd
PY - 2024/6/1
Y1 - 2024/6/1
N2 - Ga-atoms dynamic in an Ar/N2 magnetron sputtering discharge for GaN deposition is explored employing plasma diagnostic techniques such as optical emission spectroscopy and microwave interferometry. Through the assessment of gas temperature, electron temperature and density measured from the abovementioned diagnostics, we estimated both the flux and average energy of Ga-atoms impinging on the substrate. Emphasizing the working pressure as a pivotal factor, this study uncovers a correlation between the Ga-atoms flux, their average energy, and the growth rate and crystallinity of the GaN films extracted from ex-situ characterizations. Notably, the pressure value (6.6 Pa) at which both the growth rate and crystalline fraction are the greatest is also the condition at which both the flux and energy of Ga-atoms impinging on the target are maximal. The findings pave the way for improving the understanding and control of the complex interplay between plasma conditions and resulting film properties in the sputtering process.
AB - Ga-atoms dynamic in an Ar/N2 magnetron sputtering discharge for GaN deposition is explored employing plasma diagnostic techniques such as optical emission spectroscopy and microwave interferometry. Through the assessment of gas temperature, electron temperature and density measured from the abovementioned diagnostics, we estimated both the flux and average energy of Ga-atoms impinging on the substrate. Emphasizing the working pressure as a pivotal factor, this study uncovers a correlation between the Ga-atoms flux, their average energy, and the growth rate and crystallinity of the GaN films extracted from ex-situ characterizations. Notably, the pressure value (6.6 Pa) at which both the growth rate and crystalline fraction are the greatest is also the condition at which both the flux and energy of Ga-atoms impinging on the target are maximal. The findings pave the way for improving the understanding and control of the complex interplay between plasma conditions and resulting film properties in the sputtering process.
KW - Gallium nitride (GaN)
KW - III-V semiconductors
KW - Microwave interferometry
KW - Optical emission spectroscopy
KW - Plasma
KW - Plasma surface interaction
KW - Reactive sputtering
KW - Thin films
U2 - 10.1016/j.vacuum.2024.113185
DO - 10.1016/j.vacuum.2024.113185
M3 - Article
AN - SCOPUS:85189554447
SN - 0042-207X
VL - 224
JO - Vacuum
JF - Vacuum
M1 - 113185
ER -