TY - GEN
T1 - HGCROC-SI and HGCROC-SiPM
T2 - 2020 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2020
AU - Bombardi, G.
AU - Bouyjou, F.
AU - Callier, S.
AU - Dulucq, F.
AU - El Berni, M.
AU - Extier, S.
AU - Firlej, M.
AU - Fiutowski, T.
AU - Guilloux, F.
AU - Idzik, M.
AU - de la Taille, C.
AU - Marchioro, A.
AU - Moron, J.
AU - Raux, L.
AU - Swientek, K.
AU - Thienpont, D.
AU - Vergine, T.
N1 - Publisher Copyright:
© 2020 IEEE
PY - 2020/1/1
Y1 - 2020/1/1
N2 - 1 Abstract-The two variants of HGCROC are the ASICs designed to readout the more than 6 million channels of the future HGCAL of CMS, which will consist of hexagonal silicon sensors for a large part but also SiPM-on-scintillators tiles. The SiPM version of the chip was made from the silicon version by adapting only the first amplifier stage. The first aspect is on the performance for both versions in terms of noise, charge and timing, the DAQ and Trigger paths, as well as results from irradiation qualification with total ionizing dose and heavy ions for single-event effects. The third version of HGCROC chip is a major digital release, with RadHard solutions and an additional buffer.
AB - 1 Abstract-The two variants of HGCROC are the ASICs designed to readout the more than 6 million channels of the future HGCAL of CMS, which will consist of hexagonal silicon sensors for a large part but also SiPM-on-scintillators tiles. The SiPM version of the chip was made from the silicon version by adapting only the first amplifier stage. The first aspect is on the performance for both versions in terms of noise, charge and timing, the DAQ and Trigger paths, as well as results from irradiation qualification with total ionizing dose and heavy ions for single-event effects. The third version of HGCROC chip is a major digital release, with RadHard solutions and an additional buffer.
UR - https://www.scopus.com/pages/publications/85124700251
U2 - 10.1109/NSS/MIC42677.2020.9508012
DO - 10.1109/NSS/MIC42677.2020.9508012
M3 - Conference contribution
AN - SCOPUS:85124700251
T3 - 2020 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2020
BT - 2020 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2020
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 31 October 2020 through 7 November 2020
ER -