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In situ processing of InP by Flash LPCVD for surface preparation and gate oxide deposition

  • Y. I. Nissim
  • , C. Licoppe
  • , J. M. Moison
  • , C. Meriadec

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Silicon dioxide films deposited on InP substrates are obtained in a reduced pressure, air and water cooled CVD reactor, with a rapid thermal heating. It is shown that a 700°C temperature flash results in Si02 deposition rates close to 100 A/sec. High temperature deposition (700°C) is thus obtained in few seconds on InP substrates without any surface damage. These layers display excellent electrical properties well suited for MISFET applications. Improvement of the interface properties of this structure is obtained by flowing silane on the InP substrate prior to oxide deposition. interface studies show that silane reduces the InP native oxides.

Original languageEnglish
Title of host publicationESSDERC 1988 - 18th European Solid State Device Research Conference
EditorsJ.-P. Nougier, D. Gasquet
PublisherIEEE Computer Society
PagesC4213-C4215
ISBN (Electronic)2868830994
ISBN (Print)9782868830999
Publication statusPublished - 1 Jan 1988
Externally publishedYes
Event18th European Solid State Device Research Conference, ESSDERC 1988 - Montpellier, France
Duration: 13 Sept 198816 Sept 1988

Publication series

NameEuropean Solid-State Device Research Conference
ISSN (Print)1930-8876

Conference

Conference18th European Solid State Device Research Conference, ESSDERC 1988
Country/TerritoryFrance
CityMontpellier
Period13/09/8816/09/88

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