@inproceedings{17c0d1ea2db741a08aae956ea6538157,
title = "Influence of thermal ageing on long term reliability of SnAgCu solder joints",
abstract = "Reliability of SnAgCu solder joints undermechanical stress is not proven, in particular for Aeronautic and High Performance (ARP) products.They are subjected to high temperatures, severemechanical stresses and long-term mission profiles.This work is comprehended within a larger study,which has as objective the characterization of the SnAgCu alloys mechanical behaviour at the solderjoint scale and the influence of thermal ageing on it. The aim of this first work is to improve the understanding of the relationship between the microstructural and mechanical behaviour evolution of SnAgCu alloys under thermal ageing.",
author = "B. Dompierre and V. Aubin and E. Charkaluk and Filho, \{W. C.Maia\} and M. Brizoux",
year = "2009",
month = jul,
day = "21",
doi = "10.1109/ESIME.2009.4938473",
language = "English",
isbn = "9781424441617",
series = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009",
booktitle = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009",
note = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 ; Conference date: 26-04-2009 Through 29-04-2009",
}