TY - GEN
T1 - Introducing TLS/DTLS Secure Access Modules for IoT frameworks
T2 - 2017 IEEE Symposium on Computers and Communications, ISCC 2017
AU - Urien, Pascal
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/9/1
Y1 - 2017/9/1
N2 - This paper introduces security modules for IoT frameworks. Many IoT legacy infrastructures use the TLS/DTLS protocols for communication security. Security modules are tamper resistant microcontrollers implementing open TLS/DTLS applications, with small memory footprint (less than 30KB) and modest RAM sizes (<1KB), and which perform strong mutual authentications based on symmetric or asymmetric cryptographic procedures. When a pair of security modules is used at both communication ends, this architecture is called SAM (Secure Access Module), by analogy with systems involving secure elements communications. We detail the software design of such modules for javacards, and present some performance figures. Three implementations are commented running on different platforms such as, Raspberry Pi, smartphones and Arduino boards.
AB - This paper introduces security modules for IoT frameworks. Many IoT legacy infrastructures use the TLS/DTLS protocols for communication security. Security modules are tamper resistant microcontrollers implementing open TLS/DTLS applications, with small memory footprint (less than 30KB) and modest RAM sizes (<1KB), and which perform strong mutual authentications based on symmetric or asymmetric cryptographic procedures. When a pair of security modules is used at both communication ends, this architecture is called SAM (Secure Access Module), by analogy with systems involving secure elements communications. We detail the software design of such modules for javacards, and present some performance figures. Three implementations are commented running on different platforms such as, Raspberry Pi, smartphones and Arduino boards.
KW - Identity
KW - IoT
KW - SAM
KW - Secure Element
KW - Security
UR - https://www.scopus.com/pages/publications/85030550030
U2 - 10.1109/ISCC.2017.8024533
DO - 10.1109/ISCC.2017.8024533
M3 - Conference contribution
AN - SCOPUS:85030550030
T3 - Proceedings - IEEE Symposium on Computers and Communications
SP - 220
EP - 227
BT - 2017 IEEE Symposium on Computers and Communications, ISCC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 3 July 2017 through 7 July 2017
ER -