TY - GEN
T1 - Irradiation Testing of HGCROC3
T2 - 2022 IEEE Nuclear Science Symposium, Medical Imaging Conference, and Room Temperature Semiconductor Detector Conference, IEEE NSS MIC RTSD 2022
AU - Vernazza, Elena
AU - Beaudette, Florian
AU - Davignon, Olivier
AU - De La Taille, Christophe
AU - Thienpont, Damien
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022/1/1
Y1 - 2022/1/1
N2 - The HGCROC3 is the final version of the front-end ASIC designed to readout the 6 million channels of the future HGCAL detector. Along with cutting-edge specifications in terms of low noise, time measurement precision, and ability to contribute to the Level-1 trigger decision, one of the key requirements for the HGCROC3 is a high radiation tolerance.Several irradiation campaigns have been carried out on HGCROC3 prototypes, with particular emphasis on the Total Integrated Dose (TID) and the Single-Event Effect (SEE) tests. In the context of the TID campaign, results are presented in terms of power consumption, charge and time measurement performance, clocks, and serial links robustness. Although previous versions of the same ASIC architecture show encouraging results in terms of SEE hardness, in this final version of the chip a special care is taken to reach the radiation tolerance requirement for critical blocks such as the digital counters, the clocks and the serializers. The corresponding studies of SEE effects on these components are also reported in this contribution.
AB - The HGCROC3 is the final version of the front-end ASIC designed to readout the 6 million channels of the future HGCAL detector. Along with cutting-edge specifications in terms of low noise, time measurement precision, and ability to contribute to the Level-1 trigger decision, one of the key requirements for the HGCROC3 is a high radiation tolerance.Several irradiation campaigns have been carried out on HGCROC3 prototypes, with particular emphasis on the Total Integrated Dose (TID) and the Single-Event Effect (SEE) tests. In the context of the TID campaign, results are presented in terms of power consumption, charge and time measurement performance, clocks, and serial links robustness. Although previous versions of the same ASIC architecture show encouraging results in terms of SEE hardness, in this final version of the chip a special care is taken to reach the radiation tolerance requirement for critical blocks such as the digital counters, the clocks and the serializers. The corresponding studies of SEE effects on these components are also reported in this contribution.
KW - ASIC
KW - CMS
KW - HGCAL
KW - HGCROC
KW - Radiation Tolerance
KW - SEE
KW - TID
U2 - 10.1109/NSS/MIC44845.2022.10399091
DO - 10.1109/NSS/MIC44845.2022.10399091
M3 - Conference contribution
AN - SCOPUS:85185384110
T3 - 2022 IEEE NSS/MIC RTSD - IEEE Nuclear Science Symposium, Medical Imaging Conference and Room Temperature Semiconductor Detector Conference
BT - 2022 IEEE NSS/MIC RTSD - IEEE Nuclear Science Symposium, Medical Imaging Conference and Room Temperature Semiconductor Detector Conference
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 5 November 2022 through 12 November 2022
ER -