Abstract
In this paper, we have studied the stability of polymorphous silicon (pm-Si:H) and (c-Si:) bottom gate thin-film transistors (TFTs) by combining degradation and relaxation experiments under various stress conditions. We report on polymorphous silicon (pm-Si:H) TFTs with =1 after 10 h of stress and TFTs with superior stability, which show a δ V \rm TH of only 0.05 V under stress conditions similar to those encountered in active-matrix operation regime and $VD=10. Relaxation studies show that the quality of the interface between silicon nitride and pm-Si:H (or controls the stability at short stress times. Interestingly, the deposition conditions of the semiconductor layer seem to modify the quality of the a-SiN:H and thus the stability of the interface.
| Original language | English |
|---|---|
| Article number | 6104184 |
| Pages (from-to) | 23-26 |
| Number of pages | 4 |
| Journal | IEEE/OSA Journal of Display Technology |
| Volume | 8 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 1 Jan 2012 |
Keywords
- Bottom gate
- Microcrystalline silicon
- Polymorphous silicon (pm-Si:H)
- Thin-film transistor (TFT)
- Threshold voltage
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