Abstract
In this paper, thermomechanical couplings at the grain scale in metallic polycrystals are studied during the deformation process through an original experimental setup and improved calibration tools and full-field treatments. In order to perform intragranular thermomechanical analysis in a metallic polycrystal at the grain scale, a crystallography-based technique for the projection of the temperature and displacement fields on a polynomial basis is proposed. It enables intragranular coupled analysis of strain and temperature full-field data. Macroscopic, mesoscopic and granular analysis are then conducted and it is shown that the determination of a macroscopic yield stress as well as a critical resolved shear stress in grains is possible. Early local microplastic activity is therefore thermomechanically confirmed.
| Original language | English |
|---|---|
| Pages (from-to) | 741-752 |
| Number of pages | 12 |
| Journal | Experimental Mechanics |
| Volume | 55 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 1 Apr 2015 |
| Externally published | Yes |
Keywords
- Digital image correlation
- EBSD
- Infrared thermography
- Microstructure
- Plasticity