@inproceedings{911892007d3c4d55a67f39ed8b77dbdd,
title = "OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project",
abstract = "In late 2008, an international consortium for development of vertically integrated (3D) readout electronics was created to explore features available from this technology. In this paper, the OMEGAPIX circuit is presented. It is the first front-end ASIC prototype designed at LAL in 3D technology. It has been submitted on May 2009. At first, a short reminder of 3D technology is presented. Then the IC design is explained: analogue tier, digital tier and testability.",
author = "A. Lounis and \{De La Taille\}, C. and N. Seguin-Moreau and G. Martin-Chassard and D. Thienpont and Y. Guo",
year = "2009",
month = dec,
day = "1",
language = "English",
isbn = "9789290833352",
series = "Proceedings of the Topical Workshop on Electronics for Particle Physics, TWEPP 2009",
pages = "443--447",
booktitle = "Proceedings of the Topical Workshop on Electronics for Particle Physics, TWEPP 2009",
note = "Topical Workshop on Electronics for Particle Physics, TWEPP 2009 ; Conference date: 21-09-2009 Through 25-09-2009",
}