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Planar Thermal Hall Effect from Phonons in Cuprates

  • Lu Chen
  • , Léna Le Roux
  • , Gaël Grissonnanche
  • , Marie Eve Boulanger
  • , Steven Thériault
  • , Ruixing Liang
  • , D. A. Bonn
  • , W. N. Hardy
  • , S. Pyon
  • , T. Takayama
  • , H. Takagi
  • , Ke Jun Xu
  • , Zhi Xun Shen
  • , Louis Taillefer
  • Département de Physique
  • Université de Sherbrooke
  • Departement of Physics and Astronomy
  • University of British Columbia
  • CIFAR
  • Department Of Advanced Materials Science
  • University of Tokyo
  • Department of Applied Physics
  • CNRS
  • Department of Physics
  • Institute for Functional Matter and Quantum Technologies
  • University of Suttgart
  • Geballe Laboratory for Advanced Materials
  • Stanford Institute for Materials and Energy Sciences
  • Stanford Linear Accelerator Center
  • Departments of Physics and Applied Physics
  • Stanford University

Research output: Contribution to journal › Article › peer-review

10 Citations (Scopus)

Abstract

A surprising "planar"thermal Hall effect, whereby the field is parallel to the current, has recently been observed in a few magnetic insulators; this effect has been attributed to exotic excitations such as Majorana fermions or chiral magnons. Here, we investigate the possibility of a planar thermal Hall effect in three different cuprate materials, in which the conventional thermal Hall conductivity κxy (with an out-of-plane field perpendicular to the current) is dominated by either electrons or phonons. Our measurements show that the planar κxy from electrons in cuprates is zero, as expected from the absence of a Lorentz force in the planar configuration. By contrast, we observe a sizable planar κxy in those samples where the thermal Hall response is due to phonons, even though it should, in principle, be forbidden by the high crystal symmetry. Our findings call for a careful reexamination of the mechanisms responsible for the phonon thermal Hall effect in insulators.

Original languageEnglish
Article number041011
JournalPhysical Review X
Volume14
Issue number4
DOIs
Publication statusPublished - 1 Oct 2024

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