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Process monitoring of semiconductor thin films and interfaces by spectroellipsometry

Research output: Contribution to journalConference articlepeer-review

Abstract

Real-time monitoring of the growth of plasma deposited microcrystalline silicon (μc-Si:H) by multi-wavelength phase-modulated ellipsometry is presented. Several growth models for process-monitoring are reviewed. In particular the inhomogeneity in μc-Si layers is treated by allowing graded-index profile in the bulk. Using the Bruggeman effective medium theory, we describe the optical properties of μc-Si and the monitoring of the crystallinity in the upper and lower parts of the layer, and the thickness. The inversion algorithm is very fast, with calculation times within 5 s using typical PC. This method opens up ways for precise control of surface roughness, bulk thickness, and crystallization of both the top and bottom interfaces of the layer during processing devices such as solar cells and thin film transistors.

Original languageEnglish
Pages (from-to)283-290
Number of pages8
JournalApplied Surface Science
Volume154
DOIs
Publication statusPublished - 1 Feb 2000
EventThe Symposium A on Photo-Excited Processes, Diagnostics and Applications of the 1999 E-MRS Spring Conference (ICPEPA-3) - Strasbourg, France
Duration: 1 Jun 19994 Jun 1999

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