Abstract
A set of tight-binding parameters for Ni-Si compounds is being described. First tests on mechanical properties and pure silicon grain boundaries are presented.
| Original language | English |
|---|---|
| Pages (from-to) | 349-352 |
| Number of pages | 4 |
| Journal | Materials Science Forum |
| Volume | 207-209 |
| Issue number | PART 1 |
| DOIs | |
| Publication status | Published - 1 Jan 1996 |
Keywords
- Electronic Structure
- Grain Boundary
- Nickel
- Numerical Simulations
- Silicon
- Tight-Binding
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