Recent advances in improvement of thermal conductivity of epoxy-based nanocomposites through addition of fillers

Owing to their miniaturization, high integration, and high power, electronic devices generate a large amount of heat during their operation. The heat hampers normal device operation, and can even damage the electronic devices. For the removal of excess heat, there is an urgent need for a thermal management system. The excellent electrical insulation properties, good corrosion resistance, lightweight nature, low cost, and ease of processing of polymer-based composites have led to their widespread use as thermal interface materials in modern high-end electronic packaging. Among polymer matrices, epoxy resin is an ideal candidate for the preparation of thermal interface materials, because of its outstanding comprehensive properties. In this paper, the latest research results on the effect of various nanofillers on the thermal conductivity of epoxy-based composites are reviewed in detail. In particular, the characteristics of the fillers, the preparation methods of the composites, and thermal conductivity of the composites are reviewed. Furthermore, the thermal conduction mechanisms of the composites are summarized and analyzed by different models. Additionally, development prospects of thermally conductive epoxy composites are discussed problems currently faced in developing such composites are outlined and suggestions for overcoming them are presented.