Abstract
The plasma deposition of nanocrystalline silicon thin films is usually performed under a high flux of atomic hydrogen and hydrogenated chemical species. The growth mechanisms are investigated using the layer-by-layer deposition of dense nanocrystalline silicon, obtained at 250°C by alternating SiH4 and H2 plasmas. In the steady state, a minimum exposure time to the hydrogen plasma is necessary to recrystallize the amorphous top layer (10-85 Å). It is shown that this critical time is determined by the diffusion time of some mobile H through the top a-Si:H layer. The recrystallization is discussed in relation to the diffusion of hydrogen leading to the nanovoid and broken bond formation processes.
| Original language | English |
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| Pages (from-to) | 3146 |
| Number of pages | 1 |
| Journal | Applied Physics Letters |
| Volume | 66 |
| DOIs | |
| Publication status | Published - 1 Dec 1995 |