TY - JOUR
T1 - The 2021 flexible and printed electronics roadmap
AU - Bonnassieux, Yvan
AU - Brabec, Christoph J.
AU - Cao, Yong
AU - Carmichael, Tricia Breen
AU - Chabinyc, Michael L.
AU - Cheng, Kwang Ting
AU - Cho, Gyoujin
AU - Chung, Anjung
AU - Cobb, Corie L.
AU - Distler, Andreas
AU - Egelhaaf, Hans Joachim
AU - Grau, Gerd
AU - Guo, Xiaojun
AU - Haghiashtiani, Ghazaleh
AU - Huang, Tsung Ching
AU - Hussain, Muhammad M.
AU - Iniguez, Benjamin
AU - Lee, Taik Min
AU - Li, Ling
AU - Ma, Yuguang
AU - Ma, Dongge
AU - McAlpine, Michael C.
AU - Ng, Tse Nga
AU - Österbacka, Ronald
AU - Patel, Shrayesh N.
AU - Peng, Junbiao
AU - Peng, Huisheng
AU - Rivnay, Jonathan
AU - Shao, Leilai
AU - Steingart, Daniel
AU - Street, Robert A.
AU - Subramanian, Vivek
AU - Torsi, Luisa
AU - Wu, Yunyun
N1 - Publisher Copyright:
© 2021 The Author(s).
PY - 2021/6/1
Y1 - 2021/6/1
N2 - This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.
AB - This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.
KW - E-textiles
KW - Flexible and printed electronics
KW - Organic light emitting diodes
KW - Organic photovoltaics
KW - Roll-to-roll printing
KW - Sensors
KW - Thin film transistors
U2 - 10.1088/2058-8585/abf986
DO - 10.1088/2058-8585/abf986
M3 - Review article
AN - SCOPUS:85107977151
SN - 2058-8585
VL - 6
JO - Flexible and Printed Electronics
JF - Flexible and Printed Electronics
IS - 2
M1 - 023001
ER -