Thermal characterization of polycrystalline diamond using infrared thermal imaging measurement∗

Beng Kang Tay; Qinyu Kong; Laurence Bodelot; Brengere Lebental; Devi Shanker Misra

doi:10.1109/INEC.2018.8441928

Thermal characterization of polycrystalline diamond using infrared thermal imaging measurement^∗

Beng Kang Tay
, Qinyu Kong
, Laurence Bodelot
, Brengere Lebental
, Devi Shanker Misra

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Thermal characterization of polycrystalline diamond based on an infrared thermal imaging technique is proposed. The temperature mapping of polycrystalline diamond under a metal wire heating are recorded using a resolution infrared thermal imaging system. The thermal conductivity of the polycrystalline diamond is derived from the temperature profile using numerical fitting with a 3D heat diffusion model. The thermal conductivity of the polycrystalline diamond is also determined using a technique. The agreement between the thermal conductivities measured using these two techniques is within 15%.

Original language	English
Title of host publication	2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	7-8
Number of pages	2
ISBN (Print)	9781538642504
DOIs	https://doi.org/10.1109/INEC.2018.8441928
Publication status	Published - 20 Aug 2018
Externally published	Yes
Event	8th IEEE International Nanoelectronics Conferences, INEC 2018 - Kuala Lumpur, Malaysia Duration: 3 Jan 2018 → 5 Jan 2018

Publication series

Name	2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018

Conference

Conference	8th IEEE International Nanoelectronics Conferences, INEC 2018
Country/Territory	Malaysia
City	Kuala Lumpur
Period	3/01/18 → 5/01/18

Access to Document

10.1109/INEC.2018.8441928

Cite this

Tay, B. K., Kong, Q., Bodelot, L., Lebental, B., & Misra, D. S. (2018). Thermal characterization of polycrystalline diamond using infrared thermal imaging measurement^∗ In 2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018 (pp. 7-8). Article 8441928 (2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/INEC.2018.8441928

Tay, Beng Kang ; Kong, Qinyu ; Bodelot, Laurence et al. / Thermal characterization of polycrystalline diamond using infrared thermal imaging measurement^∗ 2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 7-8 (2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018).

@inproceedings{b8d865b341df41cca4071f38a38b84be,

title = "Thermal characterization of polycrystalline diamond using infrared thermal imaging measurement∗ ",

abstract = "Thermal characterization of polycrystalline diamond based on an infrared thermal imaging technique is proposed. The temperature mapping of polycrystalline diamond under a metal wire heating are recorded using a resolution infrared thermal imaging system. The thermal conductivity of the polycrystalline diamond is derived from the temperature profile using numerical fitting with a 3D heat diffusion model. The thermal conductivity of the polycrystalline diamond is also determined using a technique. The agreement between the thermal conductivities measured using these two techniques is within 15\%.",

author = "Tay, \{Beng Kang\} and Qinyu Kong and Laurence Bodelot and Brengere Lebental and Misra, \{Devi Shanker\}",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 8th IEEE International Nanoelectronics Conferences, INEC 2018 ; Conference date: 03-01-2018 Through 05-01-2018",

year = "2018",

month = aug,

day = "20",

doi = "10.1109/INEC.2018.8441928",

language = "English",

isbn = "9781538642504",

series = "2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "7--8",

booktitle = "2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018",

}

Tay, BK, Kong, Q, Bodelot, L, Lebental, B & Misra, DS 2018, Thermal characterization of polycrystalline diamond using infrared thermal imaging measurement^∗ in 2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018., 8441928, 2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018, Institute of Electrical and Electronics Engineers Inc., pp. 7-8, 8th IEEE International Nanoelectronics Conferences, INEC 2018, Kuala Lumpur, Malaysia, 3/01/18. https://doi.org/10.1109/INEC.2018.8441928

Thermal characterization of polycrystalline diamond using infrared thermal imaging measurement^∗ . / Tay, Beng Kang; Kong, Qinyu; Bodelot, Laurence et al.
2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 7-8 8441928 (2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - Thermal characterization of polycrystalline diamond based on an infrared thermal imaging technique is proposed. The temperature mapping of polycrystalline diamond under a metal wire heating are recorded using a resolution infrared thermal imaging system. The thermal conductivity of the polycrystalline diamond is derived from the temperature profile using numerical fitting with a 3D heat diffusion model. The thermal conductivity of the polycrystalline diamond is also determined using a technique. The agreement between the thermal conductivities measured using these two techniques is within 15%.

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DO - 10.1109/INEC.2018.8441928

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Tay BK, Kong Q, Bodelot L, Lebental B, Misra DS. Thermal characterization of polycrystalline diamond using infrared thermal imaging measurement^∗ In 2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 7-8. 8441928. (2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018). doi: 10.1109/INEC.2018.8441928