Thermal stabilities and dynamic mechanical properties of sulfone-containing epoxy resin cured with anhydride

Soo Jin Park; Fan Long Jin

doi:10.1016/j.polymdegradstab.2004.06.003

Thermal stabilities and dynamic mechanical properties of sulfone-containing epoxy resin cured with anhydride

Soo Jin Park, Fan Long Jin

Center for Convergent Research of Emerging Virus Infection

Research output: Contribution to journal › Article › peer-review

Abstract

A sulfone-containing epoxy resin, the diglycidylether of bisphenol-S (DGEBS), was obtained and its structure was confirmed by means of FT-IR, ¹H NMR, ¹³C NMR spectra, and elemental analysis. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the DGEBS resin cured with phthalic anhydride (PA) and tetrahydrophthalic anhydride (THPA) as curing agents were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and dynamic mechanical analysis (DMA). The cure reaction of the DGEBS/anhydride systems was initiated at a relatively low temperature in the presence of tertiary amine. The DGEBS/THPA/DMBA system showed higher glass transition temperature, initial decomposition temperature, and activation energy for decomposition than those of the DGEBS/PA/DMBA system, which was attributed to the higher cross-linking density of the DGEBS/THPA/DMBA system.

Original language	English
Pages (from-to)	515-520
Number of pages	6
Journal	Polymer Degradation and Stability
Volume	86
Issue number	3
DOIs	https://doi.org/10.1016/j.polymdegradstab.2004.06.003
Publication status	Published - 1 Dec 2004
Externally published	Yes

Keywords

Bisphenol-S
Epoxy resin
Glass transition temperature
Synthesis
Thermal properties

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10.1016/j.polymdegradstab.2004.06.003

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title = "Thermal stabilities and dynamic mechanical properties of sulfone-containing epoxy resin cured with anhydride",

abstract = "A sulfone-containing epoxy resin, the diglycidylether of bisphenol-S (DGEBS), was obtained and its structure was confirmed by means of FT-IR, 1H NMR, 13C NMR spectra, and elemental analysis. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the DGEBS resin cured with phthalic anhydride (PA) and tetrahydrophthalic anhydride (THPA) as curing agents were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and dynamic mechanical analysis (DMA). The cure reaction of the DGEBS/anhydride systems was initiated at a relatively low temperature in the presence of tertiary amine. The DGEBS/THPA/DMBA system showed higher glass transition temperature, initial decomposition temperature, and activation energy for decomposition than those of the DGEBS/PA/DMBA system, which was attributed to the higher cross-linking density of the DGEBS/THPA/DMBA system.",

keywords = "Bisphenol-S, Epoxy resin, Glass transition temperature, Synthesis, Thermal properties",

author = "Park, \{Soo Jin\} and Jin, \{Fan Long\}",

year = "2004",

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doi = "10.1016/j.polymdegradstab.2004.06.003",

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pages = "515--520",

journal = "Polymer Degradation and Stability",

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T1 - Thermal stabilities and dynamic mechanical properties of sulfone-containing epoxy resin cured with anhydride

AU - Park, Soo Jin

AU - Jin, Fan Long

PY - 2004/12/1

Y1 - 2004/12/1

N2 - A sulfone-containing epoxy resin, the diglycidylether of bisphenol-S (DGEBS), was obtained and its structure was confirmed by means of FT-IR, 1H NMR, 13C NMR spectra, and elemental analysis. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the DGEBS resin cured with phthalic anhydride (PA) and tetrahydrophthalic anhydride (THPA) as curing agents were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and dynamic mechanical analysis (DMA). The cure reaction of the DGEBS/anhydride systems was initiated at a relatively low temperature in the presence of tertiary amine. The DGEBS/THPA/DMBA system showed higher glass transition temperature, initial decomposition temperature, and activation energy for decomposition than those of the DGEBS/PA/DMBA system, which was attributed to the higher cross-linking density of the DGEBS/THPA/DMBA system.

AB - A sulfone-containing epoxy resin, the diglycidylether of bisphenol-S (DGEBS), was obtained and its structure was confirmed by means of FT-IR, 1H NMR, 13C NMR spectra, and elemental analysis. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the DGEBS resin cured with phthalic anhydride (PA) and tetrahydrophthalic anhydride (THPA) as curing agents were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and dynamic mechanical analysis (DMA). The cure reaction of the DGEBS/anhydride systems was initiated at a relatively low temperature in the presence of tertiary amine. The DGEBS/THPA/DMBA system showed higher glass transition temperature, initial decomposition temperature, and activation energy for decomposition than those of the DGEBS/PA/DMBA system, which was attributed to the higher cross-linking density of the DGEBS/THPA/DMBA system.

KW - Bisphenol-S

KW - Epoxy resin

KW - Glass transition temperature

KW - Synthesis

KW - Thermal properties

UR - https://www.scopus.com/pages/publications/5644231098

U2 - 10.1016/j.polymdegradstab.2004.06.003

DO - 10.1016/j.polymdegradstab.2004.06.003

M3 - Article

AN - SCOPUS:5644231098

SN - 0141-3910

VL - 86

SP - 515

EP - 520

JO - Polymer Degradation and Stability

JF - Polymer Degradation and Stability

IS - 3

ER -

Thermal stabilities and dynamic mechanical properties of sulfone-containing epoxy resin cured with anhydride

Abstract

Keywords

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