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Une approche de type plaque layer-wise pour la modélisation de joint de colle élastoplastique

Translated title of the contribution: A layer-wise stress approach for elastoplastic bonding

Research output: Contribution to journalArticlepeer-review

Abstract

This article is aimed at proposing an application for bonding of a layer-wise 2D finite element method for multilayers considering the laminated plate as a superposition of Reissner plates coupled by interfacial stresses. Here, despite the 2D description of the laminates, the interfaces show a particular behavior, elastic or elastoplastic (Von-Mises criterion). A double lap joint with an elastoplastic adhesive is then considered. Interface shear and normal stresses are compared to 3D finite element results.

Translated title of the contributionA layer-wise stress approach for elastoplastic bonding
Original languageFrench
Pages (from-to)413-422
Number of pages10
JournalRevue des Composites et des Materiaux Avances
Volume24
Issue number4
DOIs
Publication statusPublished - 1 Jan 2014
Externally publishedYes

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