TY - GEN
T1 - Analysis of 3D CAD MESH Simplification Approaches within the Framework of AR Applications for Industrial Assembly Lines
AU - Arige, Abhayadhathri
AU - Lavric, Traian
AU - Preda, Marius
AU - Zaharia, Titus
AU - Bricard, Emmanuel
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/6/20
Y1 - 2021/6/20
N2 - Over the last few years, Augmented Reality (AR) has being investigated as a workforce training tool in industrial assembly lines. However, when 3D CAD meshes are used in AR, embedding them in computationally light AR devices is a challenging task, since such models may be highly detailed, involving up to millions of mesh vertices. In such cases, a possible solution would be to replace the original models by some simplified versions. The crucial challenge is to preserve the quality of the models, while ensuring a fluid rendering on the AR devices, at the usual rates of 30-60 frames per second. In this paper, we analyze different simplification techniques available in the literature and select the most suited technique for CAD models, based on a detailed experimental evaluation.
AB - Over the last few years, Augmented Reality (AR) has being investigated as a workforce training tool in industrial assembly lines. However, when 3D CAD meshes are used in AR, embedding them in computationally light AR devices is a challenging task, since such models may be highly detailed, involving up to millions of mesh vertices. In such cases, a possible solution would be to replace the original models by some simplified versions. The crucial challenge is to preserve the quality of the models, while ensuring a fluid rendering on the AR devices, at the usual rates of 30-60 frames per second. In this paper, we analyze different simplification techniques available in the literature and select the most suited technique for CAD models, based on a detailed experimental evaluation.
KW - Augmented Reality
KW - CAD models
KW - assembly lines
KW - simplification
UR - https://www.scopus.com/pages/publications/85118802517
U2 - 10.1109/ISIE45552.2021.9576475
DO - 10.1109/ISIE45552.2021.9576475
M3 - Conference contribution
AN - SCOPUS:85118802517
T3 - IEEE International Symposium on Industrial Electronics
BT - Proceedings of 2021 IEEE 30th International Symposium on Industrial Electronics, ISIE 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th IEEE International Symposium on Industrial Electronics, ISIE 2021
Y2 - 20 June 2021 through 23 June 2021
ER -