TY - GEN
T1 - MHYNESYS II
T2 - 2013 IEEE International Symposium on Circuits and Systems, ISCAS 2013
AU - Hammami, O.
AU - Hamwi, K.
PY - 2013/9/9
Y1 - 2013/9/9
N2 - Next generation manycore will contain hundreds of processors and the main challenge to be solved will be the network on chip (NOC) bottleneck of these systems which restricts scalability. At the crossroad of multiple technological trends, 3D IC, optical network on chip (ONOC) and further downscale in traditional 2D semiconductor, this paper proposes hybrid NOC synthesis as a way to exploit respective technological advances as they emerge. Rather than consider design as a static view of design parameters, hybrid Network on Chip (NoC) synthesis generates a hybrid NOC under the assumption of 3D and optical network while capturing latest technological advances exposed by components libraries and EDA tools. This will be explained through MHYNESYS II, a Multi-stages Hybrid Optical-electronics Network on Chip Synthesis for Next Generation 3D IC Manycore.
AB - Next generation manycore will contain hundreds of processors and the main challenge to be solved will be the network on chip (NOC) bottleneck of these systems which restricts scalability. At the crossroad of multiple technological trends, 3D IC, optical network on chip (ONOC) and further downscale in traditional 2D semiconductor, this paper proposes hybrid NOC synthesis as a way to exploit respective technological advances as they emerge. Rather than consider design as a static view of design parameters, hybrid Network on Chip (NoC) synthesis generates a hybrid NOC under the assumption of 3D and optical network while capturing latest technological advances exposed by components libraries and EDA tools. This will be explained through MHYNESYS II, a Multi-stages Hybrid Optical-electronics Network on Chip Synthesis for Next Generation 3D IC Manycore.
UR - https://www.scopus.com/pages/publications/84883373527
U2 - 10.1109/ISCAS.2013.6571847
DO - 10.1109/ISCAS.2013.6571847
M3 - Conference contribution
AN - SCOPUS:84883373527
SN - 9781467357609
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 325
EP - 328
BT - 2013 IEEE International Symposium on Circuits and Systems, ISCAS 2013
Y2 - 19 May 2013 through 23 May 2013
ER -