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Shock response of a model structured nanofoam of Cu

  • F. P. Zhao
  • , Q. An
  • , B. Li
  • , H. A. Wu
  • , W. A. Goddard
  • , S. N. Luo
  • University of Science and Technology of China
  • Peac Institute of Multiscale Sciences
  • California Institute of Technology
  • Sichuan University

Résultats de recherche: Contribution à un journalArticleRevue par des pairs

Résumé

Using large-scale molecular dynamics simulations, we investigate shock response of a model Cu nanofoam with cylindrical voids and a high initial porosity (50% theoretical density), including elastic and plastic deformation, Hugoniot states, shock-induced melting, partial or complete void collapse, nanojetting, and hotspot formation. The elastic-plastic and overtaking shocks are observed at different shock strengths. The simulated Hugoniot states can be described with a modified, power-law P - α (pressure-porosity) model, and agree with shock experiments on Cu powders, as well as the compacted Hugoniot predicted with the Grüneisen equation of state. Shock-induced melting shows no clear signs of bulk premelting or superheating. Voids collapse via plastic flow nucleated from voids, and the exact processes are shock strength dependent. With increasing shock strengths, void collapse transits from the "geometrical" mode (collapse of a void is dominated by crystallography and void geometry and can be different from that of one another) to "hydrodynamic" mode (collapse of a void is similar to one another); the collapse may be achieved predominantly by flow along the {111} slip planes, by way of alternating compression and tension zones, by means of transverse flows, via forward and transverse flows, or through forward nanojetting. The internal jetting induces pronounced shock front roughening, leading to internal hotspot formation and sizable high speed jets on atomically flat free surfaces.

langue originaleAnglais
Numéro d'article063516
journalJournal of Applied Physics
Volume113
Numéro de publication6
Les DOIs
étatPublié - 14 févr. 2013
Modification externeOui

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