Synthesis and characterization of a novel silicon-containing epoxy resin

Soo Jin Park; Fan Long Jin; Jae Rock Lee

doi:10.1007/BF03219009

Synthesis and characterization of a novel silicon-containing epoxy resin

Soo Jin Park
, Fan Long Jin
, Jae Rock Lee

Center for Convergent Research of Emerging Virus Infection

Résultats de recherche: Contribution à un journal › Article › Revue par des pairs

Résumé

A novel silicon-containing epoxy resin, the diglycidylether of bisphenol A-silicon (DGEBA-Si), was synthesized and characterized. The properties of the DGEBA-Si epoxy resin cured with 4,4-diaminodiphenyl methane (DDM), including its cure behavior, glass transition temperature, thermal stability, and mechanical strength were investigated. The char yield of the DGEBA-Si/DDM system was higher than that of a commercial DGEBA/DDM system, indicating that the DGEBA-Si epoxy resin showed good flame-retardance. The cured DGEBA-Si/DDM specimens possessed lower glass transition temperatures and higher mechanical properties than DGEBA/DDM specimens. These features were attributed to the introduction of siloxane groups into the main chain of the epoxy resin, which resulted in the improved flexibility of the cured DGEBA-Si/DDM system.

langue originale	Anglais
Pages (de - à)	8-13
Nombre de pages	6
journal	Macromolecular Research
Volume	13
Numéro de publication	1
Les DOIs	https://doi.org/10.1007/BF03219009
état	Publié - 1 janv. 2005
Modification externe	Oui

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10.1007/BF03219009

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title = "Synthesis and characterization of a novel silicon-containing epoxy resin",

abstract = "A novel silicon-containing epoxy resin, the diglycidylether of bisphenol A-silicon (DGEBA-Si), was synthesized and characterized. The properties of the DGEBA-Si epoxy resin cured with 4,4-diaminodiphenyl methane (DDM), including its cure behavior, glass transition temperature, thermal stability, and mechanical strength were investigated. The char yield of the DGEBA-Si/DDM system was higher than that of a commercial DGEBA/DDM system, indicating that the DGEBA-Si epoxy resin showed good flame-retardance. The cured DGEBA-Si/DDM specimens possessed lower glass transition temperatures and higher mechanical properties than DGEBA/DDM specimens. These features were attributed to the introduction of siloxane groups into the main chain of the epoxy resin, which resulted in the improved flexibility of the cured DGEBA-Si/DDM system.",

keywords = "Epoxy, Mechanical properties, Silicon, Synthesis, Thermal properties",

author = "Park, \{Soo Jin\} and Jin, \{Fan Long\} and Lee, \{Jae Rock\}",

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AU - Park, Soo Jin

AU - Jin, Fan Long

AU - Lee, Jae Rock

PY - 2005/1/1

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N2 - A novel silicon-containing epoxy resin, the diglycidylether of bisphenol A-silicon (DGEBA-Si), was synthesized and characterized. The properties of the DGEBA-Si epoxy resin cured with 4,4-diaminodiphenyl methane (DDM), including its cure behavior, glass transition temperature, thermal stability, and mechanical strength were investigated. The char yield of the DGEBA-Si/DDM system was higher than that of a commercial DGEBA/DDM system, indicating that the DGEBA-Si epoxy resin showed good flame-retardance. The cured DGEBA-Si/DDM specimens possessed lower glass transition temperatures and higher mechanical properties than DGEBA/DDM specimens. These features were attributed to the introduction of siloxane groups into the main chain of the epoxy resin, which resulted in the improved flexibility of the cured DGEBA-Si/DDM system.

AB - A novel silicon-containing epoxy resin, the diglycidylether of bisphenol A-silicon (DGEBA-Si), was synthesized and characterized. The properties of the DGEBA-Si epoxy resin cured with 4,4-diaminodiphenyl methane (DDM), including its cure behavior, glass transition temperature, thermal stability, and mechanical strength were investigated. The char yield of the DGEBA-Si/DDM system was higher than that of a commercial DGEBA/DDM system, indicating that the DGEBA-Si epoxy resin showed good flame-retardance. The cured DGEBA-Si/DDM specimens possessed lower glass transition temperatures and higher mechanical properties than DGEBA/DDM specimens. These features were attributed to the introduction of siloxane groups into the main chain of the epoxy resin, which resulted in the improved flexibility of the cured DGEBA-Si/DDM system.

KW - Epoxy

KW - Mechanical properties

KW - Silicon

KW - Synthesis

KW - Thermal properties

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JO - Macromolecular Research

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Synthesis and characterization of a novel silicon-containing epoxy resin

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