Synthesis and thermal properties of urethane-containing epoxy resin

Fan Long Jin; Heng Chang Liu; Baoqing Yang; Soo Jin Park

doi:10.1016/j.jiec.2014.10.006

Synthesis and thermal properties of urethane-containing epoxy resin

Fan Long Jin
, Heng Chang Liu
, Baoqing Yang
, Soo Jin Park

Jilin Institute of Chemical Technology
Jilin City Scientific and Technological Information Institute
Inha University

Résultats de recherche: Contribution à un journal › Article › Revue par des pairs

Résumé

A urethane-containing epoxy resin was successfully synthesized by reacting bisphenol A with 1,6-hexamethylene diisocyanate and epichlorohydrin. The chemical structure of urethane-containing epoxy resin was confirmed using FT-IR, ¹HNMR, and elemental analysis. DSC results indicated that the initial curing and maximum exothermic peak temperatures of urethane-containing epoxy resin cured with 4,4'-diaminodiphenylmethane were 60°C and 135°C, respectively; these values were lower than those of a bisphenol A-based epoxy resin. The thermal stability of epoxy resins was studied using TGA, and it was found that the degradation temperature of urethane-containing epoxy resin was lower than that of bisphenol A-based epoxy resin under the same conditions.

langue originale	Anglais
Pages (de - à)	20-23
Nombre de pages	4
journal	Journal of Industrial and Engineering Chemistry
Volume	24
Les DOIs	https://doi.org/10.1016/j.jiec.2014.10.006
état	Publié - 25 avr. 2015
Modification externe	Oui

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10.1016/j.jiec.2014.10.006

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title = "Synthesis and thermal properties of urethane-containing epoxy resin",

abstract = "A urethane-containing epoxy resin was successfully synthesized by reacting bisphenol A with 1,6-hexamethylene diisocyanate and epichlorohydrin. The chemical structure of urethane-containing epoxy resin was confirmed using FT-IR, 1HNMR, and elemental analysis. DSC results indicated that the initial curing and maximum exothermic peak temperatures of urethane-containing epoxy resin cured with 4,4'-diaminodiphenylmethane were 60°C and 135°C, respectively; these values were lower than those of a bisphenol A-based epoxy resin. The thermal stability of epoxy resins was studied using TGA, and it was found that the degradation temperature of urethane-containing epoxy resin was lower than that of bisphenol A-based epoxy resin under the same conditions.",

keywords = "Bisphenol A, Epoxy resin, Initial curing temperature, Thermal decomposition temperature, Urethane",

author = "Jin, \{Fan Long\} and Liu, \{Heng Chang\} and Baoqing Yang and Park, \{Soo Jin\}",

note = "Publisher Copyright: {\textcopyright} 2014 The Korean Society of Industrial and Engineering Chemistry.",

year = "2015",

month = apr,

day = "25",

doi = "10.1016/j.jiec.2014.10.006",

language = "English",

volume = "24",

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TY - JOUR

T1 - Synthesis and thermal properties of urethane-containing epoxy resin

AU - Jin, Fan Long

AU - Liu, Heng Chang

AU - Yang, Baoqing

AU - Park, Soo Jin

PY - 2015/4/25

Y1 - 2015/4/25

N2 - A urethane-containing epoxy resin was successfully synthesized by reacting bisphenol A with 1,6-hexamethylene diisocyanate and epichlorohydrin. The chemical structure of urethane-containing epoxy resin was confirmed using FT-IR, 1HNMR, and elemental analysis. DSC results indicated that the initial curing and maximum exothermic peak temperatures of urethane-containing epoxy resin cured with 4,4'-diaminodiphenylmethane were 60°C and 135°C, respectively; these values were lower than those of a bisphenol A-based epoxy resin. The thermal stability of epoxy resins was studied using TGA, and it was found that the degradation temperature of urethane-containing epoxy resin was lower than that of bisphenol A-based epoxy resin under the same conditions.

AB - A urethane-containing epoxy resin was successfully synthesized by reacting bisphenol A with 1,6-hexamethylene diisocyanate and epichlorohydrin. The chemical structure of urethane-containing epoxy resin was confirmed using FT-IR, 1HNMR, and elemental analysis. DSC results indicated that the initial curing and maximum exothermic peak temperatures of urethane-containing epoxy resin cured with 4,4'-diaminodiphenylmethane were 60°C and 135°C, respectively; these values were lower than those of a bisphenol A-based epoxy resin. The thermal stability of epoxy resins was studied using TGA, and it was found that the degradation temperature of urethane-containing epoxy resin was lower than that of bisphenol A-based epoxy resin under the same conditions.

KW - Bisphenol A

KW - Epoxy resin

KW - Initial curing temperature

KW - Thermal decomposition temperature

KW - Urethane

UR - https://www.scopus.com/pages/publications/84930085184

U2 - 10.1016/j.jiec.2014.10.006

DO - 10.1016/j.jiec.2014.10.006

M3 - Article

AN - SCOPUS:84930085184

SN - 1226-086X

VL - 24

SP - 20

EP - 23

JO - Journal of Industrial and Engineering Chemistry

JF - Journal of Industrial and Engineering Chemistry

ER -

Synthesis and thermal properties of urethane-containing epoxy resin

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