The 2021 flexible and printed electronics roadmap

Yvan Bonnassieux; Christoph J. Brabec; Yong Cao; Tricia Breen Carmichael; Michael L. Chabinyc; Kwang Ting Cheng; Gyoujin Cho; Anjung Chung; Corie L. Cobb; Andreas Distler; Hans Joachim Egelhaaf; Gerd Grau; Xiaojun Guo; Ghazaleh Haghiashtiani; Tsung Ching Huang; Muhammad M. Hussain; Benjamin Iniguez; Taik Min Lee; Ling Li; Yuguang Ma; Dongge Ma; Michael C. McAlpine; Tse Nga Ng; Ronald Österbacka; Shrayesh N. Patel; Junbiao Peng; Huisheng Peng; Jonathan Rivnay; Leilai Shao; Daniel Steingart; Robert A. Street; Vivek Subramanian; Luisa Torsi; Yunyun Wu

doi:10.1088/2058-8585/abf986

The 2021 flexible and printed electronics roadmap

Yvan Bonnassieux
, Christoph J. Brabec
, Yong Cao
, Tricia Breen Carmichael
, Michael L. Chabinyc
, Kwang Ting Cheng
, Gyoujin Cho
, Anjung Chung
, Corie L. Cobb
, Andreas Distler
, Hans Joachim Egelhaaf
, Gerd Grau
, Xiaojun Guo
, Ghazaleh Haghiashtiani
, Tsung Ching Huang
, Muhammad M. Hussain
, Benjamin Iniguez
, Taik Min Lee
, Ling Li
, Yuguang Ma

Dongge Ma, Michael C. McAlpine, Tse Nga Ng, Ronald Österbacka, Shrayesh N. Patel, Junbiao Peng, Huisheng Peng, Jonathan Rivnay, Leilai Shao, Daniel Steingart, Robert A. Street, Vivek Subramanian, Luisa Torsi, Yunyun Wu

Friedrich-Alexander University (FAU) Erlangen-Nürnberg and Universitätsklinikum Erlangen
Bavarian Center for Applied Energy Research e.V.
Research Centre Julich
South China University of Technology
University of Windsor
University of California
The Hong Kong University of Science and Technology
Sungkyunkwan University
Korea Flexible & Printed Electronics Association
University of Washington
York University
Shanghai Jiao Tong University
University of Minnesota
Hewlett Packard Laboratory
King Abdullah University of Science and Technology
University of California
Universitat Rovira i Virgili
Korea Institute of Machinery and Materials (KIMM)
Institute of Microelectronics Chinese Academy of Sciences
University of Chinese Academy of Sciences
University of California, San Diego
Åbo Akademi University
University of Chicago
Fudan University
Northwestern University
Columbia University
Palo Alto Research Center Incorporated
ENAC-IIC-GEL
Università degli studi di Bari Aldo Moro

Résultats de recherche: Contribution à un journal › Article de révision › Revue par des pairs

191 Citations (Scopus)

Résumé

This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

langue originale	Anglais
Numéro d'article	023001
journal	Flexible and Printed Electronics
Volume	6
Numéro de publication	2
Les DOIs	https://doi.org/10.1088/2058-8585/abf986
état	Publié - 1 juin 2021

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10.1088/2058-8585/abf986

Contient cette citation

Bonnassieux, Y., Brabec, C. J., Cao, Y., Carmichael, T. B., Chabinyc, M. L., Cheng, K. T., Cho, G., Chung, A., Cobb, C. L., Distler, A., Egelhaaf, H. J., Grau, G., Guo, X., Haghiashtiani, G., Huang, T. C., Hussain, M. M., Iniguez, B., Lee, T. M., Li, L., ... Wu, Y. (2021). The 2021 flexible and printed electronics roadmap. Flexible and Printed Electronics, 6(2), Article 023001. https://doi.org/10.1088/2058-8585/abf986

@article{388faa95958241c3ae04779e20d6780a,

title = "The 2021 flexible and printed electronics roadmap",

abstract = "This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1{\textendash}9), fabrication techniques (sections 10{\textendash}12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.",

keywords = "E-textiles, Flexible and printed electronics, Organic light emitting diodes, Organic photovoltaics, Roll-to-roll printing, Sensors, Thin film transistors",

author = "Yvan Bonnassieux and Brabec, \{Christoph J.\} and Yong Cao and Carmichael, \{Tricia Breen\} and Chabinyc, \{Michael L.\} and Cheng, \{Kwang Ting\} and Gyoujin Cho and Anjung Chung and Cobb, \{Corie L.\} and Andreas Distler and Egelhaaf, \{Hans Joachim\} and Gerd Grau and Xiaojun Guo and Ghazaleh Haghiashtiani and Huang, \{Tsung Ching\} and Hussain, \{Muhammad M.\} and Benjamin Iniguez and Lee, \{Taik Min\} and Ling Li and Yuguang Ma and Dongge Ma and McAlpine, \{Michael C.\} and Ng, \{Tse Nga\} and Ronald {\"O}sterbacka and Patel, \{Shrayesh N.\} and Junbiao Peng and Huisheng Peng and Jonathan Rivnay and Leilai Shao and Daniel Steingart and Street, \{Robert A.\} and Vivek Subramanian and Luisa Torsi and Yunyun Wu",

note = "Publisher Copyright: {\textcopyright} 2021 The Author(s).",

year = "2021",

month = jun,

day = "1",

doi = "10.1088/2058-8585/abf986",

language = "English",

volume = "6",

journal = "Flexible and Printed Electronics",

issn = "2058-8585",

publisher = "Institute of Physics Publishing",

number = "2",

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Bonnassieux, Y, Brabec, CJ, Cao, Y, Carmichael, TB, Chabinyc, ML, Cheng, KT, Cho, G, Chung, A, Cobb, CL, Distler, A, Egelhaaf, HJ, Grau, G, Guo, X, Haghiashtiani, G, Huang, TC, Hussain, MM, Iniguez, B, Lee, TM, Li, L, Ma, Y, Ma, D, McAlpine, MC, Ng, TN, Österbacka, R, Patel, SN, Peng, J, Peng, H, Rivnay, J, Shao, L, Steingart, D, Street, RA, Subramanian, V, Torsi, L & Wu, Y 2021, 'The 2021 flexible and printed electronics roadmap', Flexible and Printed Electronics, VOL. 6, Numéro 2, 023001. https://doi.org/10.1088/2058-8585/abf986

TY - JOUR

T1 - The 2021 flexible and printed electronics roadmap

AU - Bonnassieux, Yvan

AU - Brabec, Christoph J.

AU - Cao, Yong

AU - Carmichael, Tricia Breen

AU - Chabinyc, Michael L.

AU - Cheng, Kwang Ting

AU - Cho, Gyoujin

AU - Chung, Anjung

AU - Cobb, Corie L.

AU - Distler, Andreas

AU - Egelhaaf, Hans Joachim

AU - Grau, Gerd

AU - Guo, Xiaojun

AU - Haghiashtiani, Ghazaleh

AU - Huang, Tsung Ching

AU - Hussain, Muhammad M.

AU - Iniguez, Benjamin

AU - Lee, Taik Min

AU - Li, Ling

AU - Ma, Yuguang

AU - Ma, Dongge

AU - McAlpine, Michael C.

AU - Ng, Tse Nga

AU - Österbacka, Ronald

AU - Patel, Shrayesh N.

AU - Peng, Junbiao

AU - Peng, Huisheng

AU - Rivnay, Jonathan

AU - Shao, Leilai

AU - Steingart, Daniel

AU - Street, Robert A.

AU - Subramanian, Vivek

AU - Torsi, Luisa

AU - Wu, Yunyun

PY - 2021/6/1

Y1 - 2021/6/1

N2 - This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

AB - This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

KW - E-textiles

KW - Flexible and printed electronics

KW - Organic light emitting diodes

KW - Organic photovoltaics

KW - Roll-to-roll printing

KW - Sensors

KW - Thin film transistors

U2 - 10.1088/2058-8585/abf986

DO - 10.1088/2058-8585/abf986

M3 - Review article

AN - SCOPUS:85107977151

SN - 2058-8585

VL - 6

JO - Flexible and Printed Electronics

JF - Flexible and Printed Electronics

IS - 2

M1 - 023001

ER -

The 2021 flexible and printed electronics roadmap

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