Résumé
CIGSe absorber was etched in HBr/Br2/H2O to prepare defined thicknesses of CIGSe between 2.7 and 0.5 μm. We established a reproducible method of reducing the absorber thickness via chemical etching. We determine the dissolution kinetics rate of CIGSe using trace analysis by graphite furnace atomic absorption spectrometry of Ga and Cu. The roughness of the etching surface decreases during the first 500 nm of the etching to a steady state value of the root-mean-square roughness near 50 nm. X-ray photoelectron spectroscopy analyses demonstrate an etching process occurring with a constant chemical composition of the treated surface acidic bromine solutions provide a controlled chemical thinning process resulting in an almost flat surface and a very low superficial Se0 enrichment.
| langue originale | Anglais |
|---|---|
| Pages (de - à) | 7207-7211 |
| Nombre de pages | 5 |
| journal | Thin Solid Films |
| Volume | 519 |
| Numéro de publication | 21 |
| Les DOIs | |
| état | Publié - 31 août 2011 |
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