TY - GEN
T1 - Towards Reliability MRAM for Energy-Efficient Spin-orbit Torque Switching
AU - Fang, Zhenghan
AU - Naviner, Lirida
AU - Wang, Wen
AU - Le, Wei
AU - Cai, Hao
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024/1/1
Y1 - 2024/1/1
N2 - This work reviews the development of spin orbit torque (SOT) magnetic random access memory (MRAM) with respect to reliability over the past two decades. It presents an in-depth exploration of the foundational knowledge and physical modeling of SOT devices, detailing the impact of process, voltage, and temperature (PVT) variations alongside challenges in read and write reliability. Moreover, this review further investigates and synthesizes the recent advances in reliability enhancement strategies for SOT-MRAM at the device, manufacturing, circuit, and architectural levels. The overarching aim of this review is to foster further research into the reliability of SOT-MRAM within advanced process nodes, emphasizing its potential utility as a versatile general-purpose memory.
AB - This work reviews the development of spin orbit torque (SOT) magnetic random access memory (MRAM) with respect to reliability over the past two decades. It presents an in-depth exploration of the foundational knowledge and physical modeling of SOT devices, detailing the impact of process, voltage, and temperature (PVT) variations alongside challenges in read and write reliability. Moreover, this review further investigates and synthesizes the recent advances in reliability enhancement strategies for SOT-MRAM at the device, manufacturing, circuit, and architectural levels. The overarching aim of this review is to foster further research into the reliability of SOT-MRAM within advanced process nodes, emphasizing its potential utility as a versatile general-purpose memory.
KW - Behavioral modeling
KW - Spin orbit torque magnetic random access memory (SOT-MRAM)
KW - advanced technology nodes
KW - reliability issues
UR - https://www.scopus.com/pages/publications/85207847386
U2 - 10.1109/SBCCI62366.2024.10704006
DO - 10.1109/SBCCI62366.2024.10704006
M3 - Conference contribution
AN - SCOPUS:85207847386
T3 - Proceedings - 37th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design, SBCCI 2024
BT - Proceedings - 37th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design, SBCCI 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 37th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design, SBCCI 2024
Y2 - 2 September 2024 through 6 September 2024
ER -